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  Datasheet File OCR Text:
 MCC
TM
Micro Commercial Components
omponents 20736 Marilla Street Chatsworth !"# $
% !"#
BC856A THRU BC858C
PNP Small Signal Transistor 310mW
SOT-23
A D
Features
Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 and MSL Rating 1
Ideally Suited for Automatic Insertion 150 C Junction Temperature For Switching and AF Amplifier Applications
o
Mechanical Data
Case: SOT-23, Molded Plastic Terminals: Solderable per MIL-STD-202, Method 208 Polarity: See Diagram Weight: 0.008 grams ( approx.)
C
B
Type BC856A BC856B BC857A BC857B
Marking Code (Note 2) Marking Type 3A BC857C 3B BC858A 3E BC858B 3F BC858C
Symbol BC856 BC857 BC858 BC856 BC857 BC858 VC B O
C
Marking 3G 3J 3K 3L
Value -80 -50 -30 -65 -45 -30 -5.0 -100 -200 -200 310 Unit V
B
F E
E
G
H
J
K DIMENSIONS INCHES MIN .110 .083 .047 .035 .070 .018 .0005 .035 .003 .015 MM MIN 2.80 2.10 1.20 .89 1.78 .45 .013 .89 .085 .37
Maximum Ratings @ 25oC Unless Otherwise Specified
Charateristic Collector-Base Voltage
DIM A B C D E F G H J K
Collector-Emitter Voltage
VC E O V EBO IC IC M I EM
V V mA mA mA mW
o
Emitter-Base Voltage Collector Current Peak Collector Current Peak Emitter Current Power Dissipation@T s =50 C(Note1) Operating & Storage Temperature
o
MAX .120 .098 .055 .041 .081 .024 .0039 .044 .007 .020
MAX 3.04 2.64 1.40 1.03 2.05 .60 .100 1.12 .180 .51
NOTE
Suggested Solder Pad Layout
.031 .800 .035 .900 .079 2.000 inches mm
Pd
Tj, T S T G -55~150
C
Note: 1. Package mounted on ceramic substrate 0.7mm X 2.5cm2 area.
2. Current gain subgroup " C" is not available for BC856
.037 .950 .037 .950
www.mccsemi.com
Revision: 5
1 of 3
2008/01/01
BC856A thru BC858C
Electrical Characteristics
Characteristic Collector-Base Breakdown Voltage (Note 3) BC856 BC857 BC858 BC856 BC857 BC858 @ TA =25C unless otherwise specified Symbol V(BR)CBO Min -80 -50 -30 -65 -45 -30 -5 -- -- -- -- -- -- -- -- -- -- -- -- 125 220 420 -- -- -- -- -- -600 -- -- -- -- -- -- 100 -- -- Typ -- -- -- -- -- -- -- 200 330 600 2.7 4.5 8.7 18 30 60 1.5x10-4 2x10-4 3x10-4 180 290 520 -- -- -75 -250 -700 -850 -650 -- -- -- -- -- -- 200 3 2 Max -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 250 475 800 320 400 -300 -650 -- -750 -820 -15 -15 -15 -15 -4.0 -- -- 10 Unit V
MCC
TM
Micro Commercial Components
Test Condition IC = 10mA, IB = 0
Collector-Emitter Breakdown Voltage (Note 3)
V(BR)CEO V(BR)EBO hfe hfe hfe hie hie hie hoe hoe hoe hre hre hre hFE RqJSB RqJA VCE(SAT) VBE(SAT) VBE(ON)
V V -- -- -- kW kW kW S S S -- -- -- -- C/W C/W mV mV mV nA nA nA nA A MHz pF dB
IC = 10mA, IB = 0 IE = 1mA, IC = 0
Emitter-Base Breakdown Voltage (Note 3) H-Parameters Small Signal Current Gain Input Impedance Output Admittance Reverse Voltage Transfer Ratio Current Gain Group A B C Current Gain Group A B C Current Gain Group A B C Current Gain Group A B C Current Gain Group A B C
VCE = -5.0V, IC = -2.0mA, f = 1.0kHz
DC Current Gain (Note 3)
VCE = -5.0V, IC = -2.0mA Note 1 Note 1 IC = -10mA, IB = -0.5mA IC = -100mA, IB = -5.0mA IC = -10mA, IB = -0.5mA IC = -100mA, IB = -5.0mA VCE = -5.0V, IC = -2.0mA VCE = -5.0V, IC = -10mA VCE = -80V VCE = -50V VCE = -30V VCB = -30V VCB = -30V, TA = 150C VCE = -5.0V, IC = -10mA, f = 100MHz VCB = -10V, f = 1.0MHz VCE = -5.0V, IC = 200A, RS = 2kW, f = 1kHz, Df = 200Hz
Thermal Resistance, Junction to Substrate Backside Thermal Resistance, Junction to Ambient Collector-Emitter Saturation Voltage (Note 3) Base-Emitter Saturation Voltage (Note 3) Base-Emitter Voltage (Note 3) Collector-Cutoff Current (Note 3) BC856 BC857 BC858
ICES ICES ICES ICBO ICBO fT CCBO NF
Gain Bandwidth Product Collector-Base Capacitance Noise Figure
Notes:
1. Package mounted on ceramic substrate 0.7mm x 2.5cm2 area. 2. Current gain subgroup "C" is not available for BC856. 3. Short duration pulse test to minimize self-heating effect.
www.mccsemi.com
Revision: 5
2 of 3
2008/01/01
MCC
Micro Commercial Components
TM
Ordering Information
Device (Part Number)-TP Packing Tape&Reel;3Kpcs/Reel
***IMPORTANT NOTICE*** Micro Commercial Components Corp . reserves the right to make changes without further notice to any product herein to make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components Corp . does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights ,nor the rights of others . The user of products in such applications shall assume all risks of such use and will agree to hold Micro Commercial Components Corp . and all the companies whose products are represented on our website, harmless against all damages. ***APPLICATIONS DISCLAIMER*** Products offer by Micro Commercial Components Corp . are not intended for use in Medical, Aerospace or Military Applications.
www.mccsemi.com
Revision: 5
3 of 3
2008/01/01


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